MSI unveils AI, HPC servers with NVIDIA MGX, Intel Xeon 6

MSI has introduced its new AI and high-performance computing (HPC) server solutions featuring the NVIDIA MGX architecture and Intel Xeon 6 processors.

The servers are designed to enhance compute density, energy efficiency, and modular flexibility to address the complex requirements of AI, HPC, and data-intensive applications. MSI is making use of Intel Xeon 6 processors in its DC-MHS servers, aiming to deliver scalable performance and resilience needed for data centres to keep up with changing HPC requirements.

Danny Hsu, General Manager of MSI's Enterprise Platform Solutions, stated, "MSI's latest innovations mark a significant leap in computational power and efficiency, enabling organisations to maximise performance, adapt seamlessly to evolving needs, and drive efficiency, building a robust foundation for future growth in high-performance computing."

The new MSI CG480-S5063 AI server utilises the NVIDIA MGX architecture, integrating dual Intel Xeon 6 processors alongside eight full-height, full-length (FHFL) dual width GPU slots. It supports NVIDIA H200 NVL GPUs to cater to extensive workloads in AI, large language models (LLMs), and data analytics. The server offers 32 DDR5 DIMM slots and 20 PCIe 5.0 E1.S NVMe bays to support high throughput, as well as PCIe 5.0 x16 slots for flexible, high-speed network integration. This 4U server is catered to AI environments prioritising computational efficiency and scalability.

MSI's Intel Xeon 6 processor-based DC-MHS servers and server motherboards are crafted to meet scalable and flexible demands in HPC data centre settings. These servers include Intel Xeon 6 processors with P-cores for peak task performance and E-cores for energy-conscious operations, ensuring optimal resource allocation across different applications. With features like Extended Volume Air Cooling (EVAC) CPU heatsinks, these solutions support stable operations under substantial loads, making them adaptable to the needs of AI, analytics, and intensive computing workloads.

The DC-MHS servers utilise the OCP DC-MHS architecture, offering enhanced compute density and modular scalability. Features include optimized front I/O design and DC-SCM2 server management modules supported by Aspeed AST2600 BMC, affording data centres flexibility and power in HPC and AI environments.

The CD270-S3061-X2 is a 2U server with dual nodes designed for compute-heavy and memory-demanding HPC applications. It employs a single Intel Xeon 6 processor with a thermal design power (TDP) of up to 350W and supports 16 DDR5 DIMM slots per node. It offers six PCIe 5.0 x4 U.2 NVMe bays per node, suitable for high-speed data access required in scalable high-performance data infrastructure.

The CX270-S5062, a 2U server, is aimed at high compute throughput environments, featuring dual Intel Xeon 6 processors with a TDP of up to 350W each and providing 32 DDR5 DIMM slots. It supports up to 24 PCIe 5.0 x4 U.2 NVMe bays and dual GPU configurations, enhancing rapid data processing and AI-led computations.

Similarly, the CX271-S3066 server, also 2U, is powered by a single Intel Xeon 6 processor with a TDP of up to 350W. It supports 24 PCIe 5.0 x4 U.2 NVMe bays and 16 DDR5 DIMM slots, optimised for data-centric applications necessitating swift data access and efficient processing capabilities in support of HPC and AI demands.

MSI's DC-MHS server motherboards include M-FLW and M-DNO (Type-4, Type-2) models, powered by Intel Xeon 6 processors for efficiency and performance across compute-demanding needs. With DDR5 memory slots, high-speed PCIe 5.0 connectivity, and versatile I/O options, these motherboards facilitate the necessary processing power and scalability for advanced AI, data analytics, and HPC environments.

The D3071 M-DNO Type-2 HPM motherboard supports a single Intel Xeon 6 processor with up to a 500W TDP and includes 12 DDR5 DIMM slots. The D5062 M-FLW HPM model supports dual Intel Xeon 6 processors with a TDP of up to 350W and offers 32 DDR5 DIMM slots. The D3066 M-DNO Type-4 HPM accommodates a single Intel Xeon 6 processor with a TDP of up to 350W and supports 16 DDR5 DIMM slots. The D3061 M-DNO Type-2 HPM features similar processor capabilities as the D3066 but with 12 DDR5 DIMM slots. Moreover, the MGT1 DC-SCM2 Module adheres to OCP DC-SCM v2.0 standards, promoting cross-platform usage and reducing deployment and maintenance costs.