Dell unveils IR9000 rack & PowerCool eRDHx for AI efficiency
Dell has expanded its Orv3 rack design to accommodate 19-inch rack sleds with the introduction of the Dell Integrated Rack 9000 (IR9000) series.
The IR9000 series has been specifically developed for high-performance systems such as the PowerEdge XE9712, equipped with NVIDIA GB300 NVL72 GPUs. These systems require larger racks and are built to meet the demands of extreme compute performance, particularly for artificial intelligence (AI) and high-performance computing (HPC) workloads.
Rack-scale infrastructure
The new rack-scale architecture builds on open standards, with Dell highlighting the importance of open, efficient designs for enterprises deploying AI at scale. Dell's Integrated Rack Scale Systems (IRSS) are described as "AI-ready, scalable, and easy to deploy and manage." The products are factory-integrated, tested, and validated, which, according to Dell, allows customers to reduce the time and risk associated with integration.
According to the company, the solutions are "open and modular: aligned to OCP standards, including Open Rack V3, DC-MHS". Dell asserts that, "Faster deployment and reduced integration risk: with factory-validation to ensure Single vendor support: full rack support backed by Dell, and optional data center assessment."
The IR7000 Orv3-based racks include multi-generational Dell Direct Liquid Cooling (DLC) manifolds and can support future compute sleds with power requirements up to 480kW. Features also include a patented AC whip design, a 750mm wide chassis, and a strain relief bar intended to simplify cable management.
Focus on cooling and energy efficiency
With increased compute density comes higher thermal loads, which Dell aims to address through its PowerCool Enclosed Rear Door Heat Exchanger (eRDHx). The company claims its PowerCool eRDHx offers a new level of integrated cooling, with systems designed to handle high-temperature operations and deliver energy efficiency benefits.
Save up to 60% on cooling costs with PowerCool eRDHx-more than cooling, it's how to run more AI and HPC compute in the same footprint with greater efficiency.
The cooling technology captures and neutralises the heat generated within the rack, enabling operation at room-neutral temperatures. According to Dell's documentation, "Advanced heat capture technology neutralizes 100% of IT heat enabling operation at room temperatures."
The energy cost savings are particularly notable when the system is combined with the IR7000 racks and hybrid DLC, with up to 60% reduction in cooling energy expenses. The solution is designed to function with water temperatures of between 32-36°C, which eliminates the need for energy-intensive chilling infrastructure.
Centralised rack management is supported by the Dell Integrated Rack Controller (IRC) combined with OpenManage Enterprise (OME). The integration is intended to enable real-time, rack-level monitoring, providing cooling insights for further operational efficiency.
As noted by Dell, "Monitor, manage, and act fast with centralized rack management: The Dell Integrated Rack Controller (IRC), with OpenManage Enterprise (OME), manages the enclosed rear-door heat exchanger (eRDHx). Together, they deliver centralized, real-time rack-level monitoring, provide data-driven cooling insights that improve efficiency, and enhance risk mitigation."
Networking advances
Dell also discussed its Linear Pluggable Optics (LPO) technology, an optical networking solution that removes the need for an onboard Digital Signal Processor (DSP) chip by leveraging the host platform's DSP.
The company stated, "Lower Power draw and 50% lower consumption: 2-4W for 400GbE vs. 7-9W for traditional optics, and up to 50% lower transceiver power consumption. Lower Cost: LPOs cut the DSP chip, lowering costs for hyperscale GenAI and boosting supply options. Lower Latency: Optimized for real-time AI and HPC workloads."
LPO is compatible with Dell PowerSwitch Ethernet switches and Broadcom Thor 2 NICs, providing support for 400GbE and 800GbE data rates with the intention of allowing organisations to transition to higher bandwidth incrementally.
Commitment to open standards
Dell reaffirmed its commitment to open standards and modular hardware, indicating that its latest racks, cooling and networking technologies are developed in alignment with industry-standard specifications. The company stated, "Dell is committed to delivering open standards-based infrastructure, made enterprise ready to deliver value to our customers."
This approach, Dell claims, delivers "Open, modular hardware aligned to standards. Proven cooling innovation for AI density. Global scale and enterprise support to ensure success." The outcome, in the company's words, is "infrastructure that is AI-ready and room-neutral-delivered as a complete solution."
Dell further commented, "Open standards matter. Efficiency matters. Time-to-value matters. With Dell's latest innovations in rackscale, power and cooling with PowerCool eRDHx, and Networking with LPO, Dell shows at OCP Summit 2025 that customers don't have to choose-they can have all three, delivered today."
