DataCentreNews UK - Specialist news for cloud & data centre decision-makers

Thermal Management stories

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Europe launches HiCONNECTS to cut AI data centre power

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Europe backs HiCONNECTS project to use light-based computing and networking, aiming to ease AI-driven strain on data centre power demand.
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OWC launches first certified Thunderbolt 5 SSD enclosure

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OWC unveils Thunderbolt 5 RAID enclosure for DIY NVMe drives, targeting 8K workflows with up to 32TB capacity and 6622MB/s speeds.
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Airsys launches LiquidRack AI cooling system in UK

2 days ago
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Airsys brings LiquidRack liquid cooling to the UK, targeting AI-ready retrofits and edge sites with up to 80 kW per rack.
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Data centre market set to hit USD $1.08 trillion by 2034

2 days ago
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Cloud and AI boom to drive data centre investment as operators race to build power-hungry facilities and edge sites worldwide.
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Data centre liquid cooling market set for rapid growth

3 days ago
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Liquid cooling is moving into the mainstream as AI workloads drive demand for denser data centres and operators seek lower energy use, forecasts show.
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Iceotope passes 200 patents as AI cooling demand rises

Last week
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Iceotope expands liquid cooling patent portfolio as data centre operators seek heat-saving answers for artificial intelligence and edge computing workloads.
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Legrand expands OCP data centre kit for AI workloads

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Legrand adds Open Compute Project rack, power and cooling gear as data centre operators brace for AI-driven density and heat demands.
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Virtana launches AI observability for Nutanix environments

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Virtana extends AI observability into Nutanix Enterprise AI as firms grapple with GPU bottlenecks, failed jobs and rising production costs.
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Vertiv launches wall cooling for edge IT sites in EMEA

This month
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Vertiv unveils wall-mounted cooling system for compact edge IT rooms across EMEA as demand grows for energy-efficient thermal control.
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Tp-Link launches Wi-Fi 7 gaming routers from AUD $279

Last month
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TP-Link broadens its gaming router push with Wi-Fi 7 models from AUD $279, led by a tri-band flagship promising sharper traffic prioritisation for busy homes.
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Ferveret study says waterless cooling lifts AI efficiency

Last month
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Ferveret study with UCLA says waterless cooling boosts AI compute efficiency 15% and cuts training times while using no water.
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SATLINE upgrades Vilnius hub with Tier III resilience

Last month
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SATLINE strengthens its Vilnius hub with Tier III-aligned power and cooling redundancy, doubling generators and UPS capacity without customer downtime.
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Hands-on review: Samsung Galaxy A57 5G smartphone

Last month
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Samsung's Galaxy A57 5G gets a slimmer, lighter body, tougher build and longer software support, but the camera and features remain familiar.
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Vertiv expands Americas factories for AI data centres

Last month
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Vertiv boosts Americas manufacturing with new South Carolina and Pennsylvania sites, plus a Mexicali expansion, to meet booming AI data centre demand.
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AI surge strains data centres over power & capacity

Last month
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AI boom pushes UK data centres towards grid limits as operators warn of power, cooling and supply chain strains.
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EkkoSense adds early anomaly alerts for hybrid cooling

Last month
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EkkoSense has added automated anomaly alerts to its EkkoSoft Critical platform, flagging hybrid data centre cooling issues before outages.
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Vertiv to buy ThermoKey to boost data centre cooling

Last month
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Vertiv to acquire Italian heat-exchange specialist ThermoKey, boosting EMEA data centre cooling capacity amid rising AI power demands.
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Salute & Ecolab add cooling service for AI centres

Last month
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Salute and Ecolab join forces to streamline liquid cooling for AI data centres, integrating Cooling-as-a-Service into chip-level ops.
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Cutting valve energy use by up to 80% in data centre cooling

Last month
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Bürkert's Kick & Drop solenoid valves slash data centre cooling energy use by up to 80% while boosting durability and cutting noise.
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AMD & Samsung deepen AI memory, packaging alliance

Last month
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AMD and Samsung are deepening their alliance to co-develop HBM4 and DDR5 memory and advanced packaging for next-wave AI and data centre systems.